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| 001 | 53042 | ||
| 003 | BD-ChUET | ||
| 005 | 20191027152604.0 | ||
| 008 | 070423s2008 njua b 001 0 eng | ||
| 010 | _a 2007017041 | ||
| 015 |
_aGBA813225 _2bnb |
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| 016 | 7 |
_a014507954 _2Uk |
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| 020 | _a9780470083017 | ||
| 035 | _a(OCoLC)ocn123539645 | ||
| 040 |
_aDLC _cDLC _dBD-ChUET |
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| 050 | 0 | 0 |
_aTK7874 _b.H794 2008 |
| 082 | 0 | 0 |
_a621.381/HSM _222 |
| 100 | 1 | 0 | _aHsu, Tai-Ran. |
| 245 | 0 | 1 |
_aMEMS and microsystems : _bdesign, manufacture, and nanoscale engineering / _cTai-Ran Hsu. |
| 250 | _a2nd ed. | ||
| 260 |
_aNew Jersey : _bJohn Wiley & Sons, Inc., _cc2008. |
||
| 300 |
_axxv,550p. : _bill. ; _c24 cm. |
||
| 500 | _aIncludes index. | ||
| 504 | _aIncludes bibliographical references (p. 509-521). | ||
| 505 | 0 | _a | |
| 526 | _aME | ||
| 546 | _aenglish | ||
| 650 | 0 | _aMicroelectronics. | |
| 650 | 0 | _aMicroelectromechanical systems. | |
| 650 | 0 | _aMicroelectronic packaging. | |
| 856 | 4 | 1 |
_3Table of contents only _uhttp://www.loc.gov/catdir/toc/ecip0716/2007017041.html |
| 856 | 4 | 2 |
_3Publisher description _uhttp://www.loc.gov/catdir/enhancements/fy0741/2007017041-d.html |
| 856 | 4 | 2 |
_3Contributor biographical information _uhttp://www.loc.gov/catdir/enhancements/fy0806/2007017041-b.html |
| 906 |
_a7 _bcbc _corignew _d1 _eecip _f20 _gy-gencatlg |
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_2ddc _cBK |
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