| 000 | 00907pam a2200313 i 4500 | ||
|---|---|---|---|
| 999 |
_c7170 _d7170 |
||
| 001 | 12299 | ||
| 003 | BD-ChUET | ||
| 005 | 20221020095502.0 | ||
| 008 | 790911s1980 nyua 001 0 eng | ||
| 010 | _a 79021990 | ||
| 020 |
_a0076066002 (pbk.) : _c$12.95 |
||
| 020 | _a0070191840 | ||
| 040 |
_aDLC _cDLC _dDLC _dBD-ChUET |
||
| 050 | 0 | 0 |
_aTK7874 _b.M483 |
| 082 | 0 | 0 | _a621.38173/LYM |
| 245 | 0 | 0 |
_aMicroelectronics interconnection and packaging / _cedited by Jerry Lyman. |
| 260 |
_aNew York : _bMcGraw-Hill, _cc1980. |
||
| 300 |
_avii, 320 p. : _bill. ; _c28 cm. |
||
| 500 | _aArticles from Electronics magazine. | ||
| 500 | _aIncludes index. | ||
| 526 | _aEEE | ||
| 546 | _aEnglish. | ||
| 650 | 0 | _aIntegrated circuits. | |
| 650 | 0 | _aMicroelectronic packaging. | |
| 700 | 1 | _aLyman, Jerry, | |
| 730 | _aElectronics. | ||
| 906 |
_a7 _bcbc _corignew _d1 _eocip _f19 _gy-gencatlg |
||
| 942 |
_2ddc _cBK |
||